fast recovery diode FMN-1206S sanken electric co.,ltd. mar/21/2011 rev.0.1 1 features the FMN-1206S is a fast recovery diode which realize a peak reverse voltage of 600v and a typical forward voltage drop of 1.1v optimizing a tradeoff between v f and trr. it has the characteristics suit for pfc circuit of both dcm and crm. the high current full-mold package achieves high performance in terms of heat release and isolation. v rm ----------------------------------------------------- 600v v f ------------------------------------- 1.3v max (i f =20a) i f(av) ------------------------------------------------------ 20a t rr ------------- 100ns (if=0.5a, irp=1.0a, 75% of r.p.) applications pfc circuit (dcm, crm) high current secondary side rectifier high frequency rectifier circuit, etc. package to-220f-2l equivalent circuit absolute maximum ratings valid at ta = 25c, unless otherwise specified characteristic symbol rating unit notes transient peak reverse voltage v rsm 600 v peak reverse voltage v rm 600 v average forward current i f(av) 20 a peak surge forward current i fsm 150 a 10msec. half sinewave, one shot i 2 t limiting value i 2 t 112.5 a 2 s 1msec "f t "f 10msec junction temperature t j -40 ?^ +150 c storage temperature t stg -40 ?^ +150 c http://www.sanken - ele.co.jp (1) (2) downloaded from: http:///
fast recovery diode FMN-1206S sanken electric co.,ltd. mar/21/2011 rev.0.1 2 electrical characteristics valid at ta = 25c, unless otherwise specified characteristic symbol test conditions limits unit min. typ. max. forward voltage drop v f i f =20a 1.3 v reverse leakage current i r v r =v rm 200 a reverse leakage current under high temperature h ?e i r v r =v rm , t j =150 c 20 ma reverse recovery time trr1 i f = i rp =500ma, t j =25 ! , 90% recovery point 150 ns trr2 i f =500ma,i rp =1a, t j =25 c , 75% recovery point 100 ns thermal resistance r th(j-l) between junction and case 4.0 c /w performance curves 0 . 0 0 1 0 . 0 1 0 . 1 1 1 0 1 0 0 0 0 . 5 1 1 . 5 2 2 . 5 i f ? a? v f ? v? v f - i f t a = r t0 6 0!0 1 0 0!0 1 5 0! 6 0! r . t . 1 0 0! 1 5 0! 0 . 0 0 0 1 0 . 0 0 1 0 . 0 1 0 . 1 1 1 0 1 0 0 0 1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 0 i r ? m a? v r ? v? v r - i r t a = r t0 6 0!0 1 0 0!0 1 5 0! 6 0! r . t . 1 0 0! 1 5 0! downloaded from: http:///
fast recovery diode FMN-1206S sanken electric co.,ltd. mar/21/2011 rev.0.1 3 characteristics 0 1 0 2 0 3 0 4 0 0 2 4 6 8 1 0 1 2 1 4 1 6 1 8 2 0 0 2 4 6 8 1 0 0 1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 0 average forward current forward power dissipation i f(av) ?
p f forward power dissipation pf (w) tj=150 ! t t average forward current i f(av) (a) t/t=1/6 t/t=1/3,sinewave t/t=1/2 dc reverse voltage reverse power dissipation v r ?
p r reverse power dissipation p r (w) reverse voltage v r (v) tj=150 ! t t 1-t/t=5/6 sinewave 1-t/t=2/3 1-t/t=1/2 downloaded from: http:///
fast recovery diode FMN-1206S sanken electric co.,ltd. mar/21/2011 rev.0.1 4 derating 0 1 0 2 0 0 5 0 1 0 0 1 5 0 0 1 0 2 0 0 5 0 1 0 0 1 5 0 case temperature D average forward current tc ?
i f(av) v r =0(v) t/t=1/6 t/t=1/2 dc t/t=1/3 sinewave case temperature D average forward current tc ?
i f(av) v r =600(v) average forward current i f(av) case temperature tc ( c ) tj=150 ! t t tj=150 ! t t t/t=1/6 t/t=1/2 dc t/t=1/3,sinewave average forward current i f ( av) case temperature tc ( c ) downloaded from: http:///
fast recovery diode FMN-1206S sanken electric co.,ltd. mar/21/2011 rev.0.1 5 package outline to-220f-2l notes: 1) all liner dimensions are in millimeters 2) pb-free. device composition compliant with the rohs dir ective marking diagram 1 part number n 1 2 0 6 y m d d 2 lot number y = last digit of year(0 - 9) m = month (1 - 9,o,n or d) dd = day (01 - 31) s downloaded from: http:///
fast recovery diode FMN-1206S sanken electric co.,ltd. mar/21/2011 rev.0.1 6 operating precautions because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. cautions for storage ? ensure that storage conditions comply with the standard temperature (5 to 35c) and the standard relative humidi ty (around 40 to 75%); avoid storage locations that experience ext reme changes in temperature or humidity. ? avoid locations where dust or harmful gases are present an d avoid direct sunlight. ? reinspect for rust on leads and solderability of the produc ts that have been stored for a long time. cautions for testing and handling when tests are carried out during inspection testing and ot her standard test periods, protect the products from powe r surges from the testing device, shorts between the product pins, and wrong connections. ensure all test parameter s are within the ratings specified by sanken for the products. remarks about using silicone grease with a heatsink ? when silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. if more silicone grease than required is applied, it may produce e xcess stress. ? volatile-type silicone greases may crack after long pe riods of time, resulting in reduced heat radiation effect. si licone greases with low consistency (hard grease) may cause crac ks in the mold resin when screwing the products to a hea tsink. our recommended silicone greases for heat radiation purpo ses, which will not cause any adverse effect on the pro duct life, are indicated below: type suppliers g746 shin - etsu chemical co., ltd. yg6260 momentive p erformance m aterials inc. sc102 dow corning toray co., ltd. cautions for mounting to a heatsink ? when the flatness around the screw hole is insufficien t, such as when mounting the products to a heatsink that has an extruded (burred) screw hole, the products can be damaged, ev en with a lower than recommended screw torque. for mounting the products, the mounting surface flatness sho uld be 0.05mm or less. ? please select suitable screws for the product shape. do n ot use a flat-head machine screw because of the stress to the products. self-tapping screws are not recommended. when using self-tapping screws, the screw may enter the hole diagonally, not vertically, depending on the conditions o f hole before threading or the work situation. that may stre ss the products and may cause failures. ? recommended screw torque package recommended screw torque to - 220 , to - 220f 0.490 to 0.686 n 0? m (5 to 7 kgf 0? cm) to - 3p , to - 3pf 0.686 to 0.882 n 0? m (7 to 9 kgf 0? cm) sla 0.588 to 0.784 n 0? m (6 to 8 kgf 0? cm) ? for tightening screws, if a tightening tool (such as a dri ver) hits the products, the package may crack, and internal stress fractures may occur, which shorten the lifetime of th e electrical elements and can cause catastrophic failur e. tightening with an air driver makes a substantial impact. in additio n, a screw torque higher than the set torque can be applied a nd the package may be damaged. therefore, an electric driver is recommended. when the package is tightened at two or more places, fi rst pre-tighten with a lower torque at all places, then tight en with the specified torque. when using a power driver, torque contr ol is mandatory. ? please pay special attention about the slack of the press mold. in case that the hole diameter of the heatsink i s less than 4 mm, it may cause the resin crack at tightening. soldering ? when soldering the products, please be sure to minimize t he working time, within the following limits: 260 5 c 10 1 s (flow, 2 times) 380 10 c 3.5 0.5 s (soldering iron, 1 time) ? soldering should be at a distance of at least 1.5 mm fr om the body of the products. downloaded from: http:///
fast recovery diode FMN-1206S sanken electric co.,ltd. mar/21/2011 rev.0.1 7 important notes ? the contents in this document are subject to changes, for improvement and other purposes, without notice. make sure that this is the latest revision of the docume nt before use. ? application and operation examples described in this document a re quoted for the sole purpose of reference for the use of the products herein and sanken can assume no re sponsibility for any infringement of industrial property rights, intellectual property rights or any other rights of sanken or any third party which may result from its use. unless otherwise agreed in writing by san ken, sanken makes no warranties of any kind, whether express or implied, as to the products, including product mercha ntability, and fitness for a particular purpose and special environment, and the information, includin g its accuracy, usefulness, and reliability, included in this document. ? although sanken undertakes to enhance the quality and reliabil ity of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevit able. users of sanken products are requested to take, at their own risk, preventative measures including safe ty design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. ? sanken products listed in this document are designed and intende d for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). when considering the use of sanken products in the applicatio ns where higher reliability is required (transportation equipment and its control systems, traffi c signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nea rest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power co ntrol systems, life support systems, etc.) is strictly prohibited. ? in the case that you use sanken products or design your products by using sanken products, the reliability largely depends on the degree of derating to be made to the ra ted values. derating may be interpreted as a case that an operation range is set by derating the load from eac h rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability . in general, derating factors include electric stresses such as electric voltage, electric current, electric pow er etc., environmental stresses such as ambient temper ature, humidity etc. and thermal stress caused due to self-hea ting of semiconductor products. for these stresses, instantaneous values, maximum values and minimum values m ust be taken into consideration. in addition, it should be noted that since power devices or ics including power devices have large self-heating value, the degree of derating of junction temperature affec ts the reliability significantly. ? when using the products specified herein by either (i) combi ning other products or materials therewith or (ii) physically, chemically or otherwise processing or trea ting the products, please duly consider all possible risks that may result from all such uses in advance and proceed the rewith at your own responsibility. ? anti radioactive ray design is not considered for the pr oducts listed herein. ? sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of sankens distribution network. ? the contents in this document must not be transcribed or copi ed without sankens written consent. downloaded from: http:///
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